A S M International
ISTFA 2021 - ASM International
Prodejce
KnihyDobrovsky
- Přes 40 knihkupectví v Česku
- Osobní odběr na prodejně zdarma
- Výborné hodnocení zákazníků na Heurece
Doporučené nabídky
Popis produktu
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; scanning probe analysis; hardware attacks, security, and reverse engineering; microscopy and material characterization; nanoprobing and electrical characterization; and more.In the 21st century, the electronic market will be driven... Zobrazit více